iVS High Precision Vibration Measurement and Monitoring System

The “Wired Vibration Monitoring System” developed by TTI is a vibration monitoring structure that mainly uses a physical connection to transmit signals. It utilizes a high-precision three-axis iVS vibration sensor that connects to an IPC computer via USB cable, and the overall structure is highly integrated, allowing it to be used in a wide range of applications in the fields of industrial equipment, mechanical processing, electric drives, and semiconductor manufacturing processes.

Applications – Vibration Measurement in Semiconductor & Optoelectronics Industry
1.Monitoring wafer transfer stability of semiconductor robotic arms
2.Stability analysis of photoresist coating in semiconductor lithography tools
3.Process monitoring of wafer dicing and grinding in semiconductor packaging
4.CMP (Chemical Mechanical Polishing) equipment process diagnostics
5.Condition monitoring of facility vacuum pumps and chillers
6.Stability monitoring of panel cleaning and coating processes
7.Measurement stability analysis of precision AOI equipment
8.Probe station vibration and measurement stability monitoring

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