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Description
Product Features
Ultra-thin wireless vibration and tilt monitoring device with built-in SD card for offline data recording.
Can be attached to wafers or FOUPs for real-time process monitoring.
Applications – Precision Vibration and Tilt Monitoring
1.Monitoring wafer transfer stability of semiconductor robotic arms
2.Status analysis and monitoring of semiconductor OHT systems
3.Long-term dynamic monitoring of AGVs (Automated Guided Vehicles)
4.Internal equipment condition monitoring in semiconductor tools
5.Stability monitoring of panel handling and production equipment
6.FOUP transfer condition analysis and stability monitoring
7.Monitoring of industrial transport mechanisms
8.Conveyor belt status monitoring
Ultra-thin wireless vibration and tilt monitoring device with built-in SD card for offline data recording.
Can be attached to wafers or FOUPs for real-time process monitoring.
Applications – Precision Vibration and Tilt Monitoring
1.Monitoring wafer transfer stability of semiconductor robotic arms
2.Status analysis and monitoring of semiconductor OHT systems
3.Long-term dynamic monitoring of AGVs (Automated Guided Vehicles)
4.Internal equipment condition monitoring in semiconductor tools
5.Stability monitoring of panel handling and production equipment
6.FOUP transfer condition analysis and stability monitoring
7.Monitoring of industrial transport mechanisms
8.Conveyor belt status monitoring
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