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Non-contact Transfer for 12-inch Thin, Warped Wafers: Robot End-effectors and Wafer Aligners

Model:

Category: Key Components

Exhibitor:

CHENLUX TECHNOLOGY LTD.

Booth No: S230

Description

Thin/warped wafer transfer: Non-contact, Vortex (Bernoulli)-assisted edge gripper/flipper and wafer pre-aligner; features the exclusive SoftTouch design for secure gripping with controlled, constant force; compatible with 8-inch or 12-inch wafers.