Thin Wafer Packing/Unpacking/Sorting System

Provides an automated solution for picking, placing, and transferring wafers between canister and cassettes or SMIF pods. The system detects the spacing of wafers within the pod, enabling safe pick-and-place operations from the wafer's front side; it distinguishes between separators of various materials and colors and detects overlapping separator sheets to ensure they are placed correctly. It supports the handling of 6-inch or 8-inch warped wafers—ranging from 50 to 1,500 microns in thickness—from either the front or back side.

---