EMI Shielding with Custom Multi‑Layer CNC Machined Components

How to Achieve 90dB+ EMI Shielding with Custom Multi‑Layer CNC Machined Components for Semiconductor Equipment?
Big Stone Machinery delivers fully customizable 1‑ to 3‑layer EMI shielding solutions, integrated with precision CNC machining for semiconductor vacuum and cleanroom environments. Choose mesh counts from 20 to 400, metals from copper to stainless steel, and carrier thicknesses from 0.3mm PET to 7mm glass — all engineered for shielding effectiveness beyond 90dB.

Big Stone Machinery Co., Ltd. (Taiwan) provides premier manufacturing solutions for the semiconductor industry. We integrate Precision CNC Machining with Advanced EMI Shielding Technology, offering 1 to 3 layers of composite metal mesh structures. We support a wide variety of mesh materials including Red Copper, Brass, and Stainless Steel to meet extreme high-frequency interference requirements.

What Precision CNC Machining Capabilities Do We Offer for Semiconductor Equipment?
1. CNC Precision Parts Machining (Stainless Steel / Aluminum)
Specializing in SUS304/316L and 6061/7075 aluminum alloys. We provide high-stability precision machining for high-vacuum and highly corrosive environments critical to semiconductor equipment.
2. Advanced EDM & Precision Mold Development
Providing micron-level tolerance services for high-hardness materials and complex geometries that traditional CNC cannot achieve, satisfying the needs of semiconductor packaging and testing molds.
3. Professional Surface Treatment & Anodizing
Includes hard-coat anodizing, sandblasting, and precision polishing. We enhance ESD protection and wear resistance to ensure products comply with strict cleanroom standards.

How Can You Customize EMI Shielding Layers, Mesh, and Materials?
Our EMI shielding materials offer the highest flexibility in the industry, configurable for shielding effectiveness from 40dB to over 90dB+:
1. Layer Customization: Supports 1, 2, or 3 layers of composite mesh. More layers provide significantly higher shielding effectiveness.
2. Mesh Count: Extensive selection from 20 Mesh to 400 Mesh.
3. Metal Materials: Options include Red Copper, Brass, Stainless Steel, or Nylon Mesh.
4. Shielding Glass Carrier: Standard 4.5mm, with custom thickness available from 3mm to 7mm.
5. Shielding PET Carrier: Standard 1.5mm, with an ultra-thin 0.3mm option for high flexibility and lightweight applications.
6. Flexible Combinations: Mesh count, layers, and carrier thickness can be mixed and matched freely to optimize transparency and shielding ratios.

How to Select the Right EMI Shielding Configuration for Your Semiconductor Tool
Follow these steps to determine the optimal combination of layers, mesh, and carrier for your specific EMI requirements.
Step 1 – Define Your Attenuation Target: Determine the minimum shielding effectiveness (e.g., 60dB, 90dB+) based on your equipment's EMI exposure.
Step 2 – Choose the Mesh Layer Count: For moderate shielding, 1 layer may suffice; for extreme high‑frequency noise, select 2 or 3 composite layers.
Step 3 – Pick the Mesh Count and Material: Higher mesh counts (100–400) block higher frequencies. Select copper for conductivity, stainless steel for corrosion resistance.
Step 4 – Select Carrier Type and Thickness: Use glass (3‑7mm) for observation windows; use PET (0.3‑1.5mm) for flexible, lightweight covers.

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