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Description
Industry's First ‧ 16K 1MHz Ultra High-Speed TDI Camera
Teledyne DALSA’s new Linea HS2 sets a new benchmark in next-generation TDI technology. Designed for ultra high-speed imaging in extremely low-light environments, it delivers exceptional image quality with 16K resolution and a maximum line rate of 1 MHz.
With dual CLHS data interfaces, the Linea HS2 achieves 16 GB/s data throughput, providing proven high reliability in fast data transmission.
Seamless Upgrade with Powerful Integration
The Linea HS2 offers an easy upgrade path from Teledyne’s existing Linea HS camera series—retaining the same pixel size, optics, cables, and mounting hardware—while delivering 2.5x faster speed and maintaining power efficiency. This camera features industry-leading performance and a unique feature set that significantly enhances inspection capability in demanding applications.
Backside Illumination(BSI) Enables Ultra High-Speed Imaging
Featuring a high-sensitivity BSI (Backside Illuminated) multi-array charge-domain TDI CMOS sensor with 16K / 5 µm resolution, the Linea HS2 is optimized with enhanced quantum efficiency to meet the demanding needs of current and future machine vision systems.
Its multi-array TDI sensor architecture can be configured to optimize image quality, maximize line rate, dynamic range, or full well capacity, based on specific application needs. The on-chip binning further boosts production speed and system throughput.
Dual Camera Link HS CX4 ports support Active Optical Cables (AOCs), offering complete EMI immunity to ensure stable high-speed data transmission.
A Complete Imaging Solution
To provide a complete solution, the Linea HS2 is fully compatible with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers using the latest CLHS technology.
The Xtium2 CLHS PX8 frame grabber supports 16 Gigapixels/sec data throughput via dual CLHS CX4 ports with Active Optical Cables. Its Data Forwarding feature enables parallel processing across up to 12 host PCs, and when paired with the Linea HS2, supports cable lengths over 100 meters with full EMI immunity.
Key Applications
With high speed and high sensitivity in ultra-low light environments, the Linea HS2 is ideal for:
Semiconductor wafer inspection
High-density package inspection
Flat panel display (FPD) inspection
Gene sequencing
Digital pathology
If you're looking for maximum throughput under the most demanding conditions, the Linea HS2 is your ultimate solution.
Learn more on the LINX Taiwan website:
👉 https://bit.ly/3SArSvc
Teledyne DALSA’s new Linea HS2 sets a new benchmark in next-generation TDI technology. Designed for ultra high-speed imaging in extremely low-light environments, it delivers exceptional image quality with 16K resolution and a maximum line rate of 1 MHz.
With dual CLHS data interfaces, the Linea HS2 achieves 16 GB/s data throughput, providing proven high reliability in fast data transmission.
Seamless Upgrade with Powerful Integration
The Linea HS2 offers an easy upgrade path from Teledyne’s existing Linea HS camera series—retaining the same pixel size, optics, cables, and mounting hardware—while delivering 2.5x faster speed and maintaining power efficiency. This camera features industry-leading performance and a unique feature set that significantly enhances inspection capability in demanding applications.
Backside Illumination(BSI) Enables Ultra High-Speed Imaging
Featuring a high-sensitivity BSI (Backside Illuminated) multi-array charge-domain TDI CMOS sensor with 16K / 5 µm resolution, the Linea HS2 is optimized with enhanced quantum efficiency to meet the demanding needs of current and future machine vision systems.
Its multi-array TDI sensor architecture can be configured to optimize image quality, maximize line rate, dynamic range, or full well capacity, based on specific application needs. The on-chip binning further boosts production speed and system throughput.
Dual Camera Link HS CX4 ports support Active Optical Cables (AOCs), offering complete EMI immunity to ensure stable high-speed data transmission.
A Complete Imaging Solution
To provide a complete solution, the Linea HS2 is fully compatible with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers using the latest CLHS technology.
The Xtium2 CLHS PX8 frame grabber supports 16 Gigapixels/sec data throughput via dual CLHS CX4 ports with Active Optical Cables. Its Data Forwarding feature enables parallel processing across up to 12 host PCs, and when paired with the Linea HS2, supports cable lengths over 100 meters with full EMI immunity.
Key Applications
With high speed and high sensitivity in ultra-low light environments, the Linea HS2 is ideal for:
Semiconductor wafer inspection
High-density package inspection
Flat panel display (FPD) inspection
Gene sequencing
Digital pathology
If you're looking for maximum throughput under the most demanding conditions, the Linea HS2 is your ultimate solution.
Learn more on the LINX Taiwan website:
👉 https://bit.ly/3SArSvc
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