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Description
TP (Thermal Pad): double-sided adhesive, high insulation and thermal conductivity
PCM (Phase Change Material Pad): changes from solid to gel-like state when exceeding phase change temperature
TCK (Thermally Cured Pad): secures MOSFETs, absorbs vibration and impact
PCM (Phase Change Material Pad): changes from solid to gel-like state when exceeding phase change temperature
TCK (Thermally Cured Pad): secures MOSFETs, absorbs vibration and impact
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