Mini/Micro LED Rework Station

All in one precision rework system
Combines all the necessary functions of rework into one machine
Suitable for almost all SMD / BGA / Shielding Rework, from the smallest 008004 passive, Mini/Micro LED to 80x80mm BGA, all can be reworked.
Ø Mini/Micro LED rework by profile
Ø Non-contact tin removal
Ø Dipping solder paste onto pad (min. 0.025mm)
Ø QFN component printing solder paste
Ø Dispensing
Ø BGA chip ball implanting
Ø BGA chip single ball removal/ball replenishment
Ø Underfilled cutting
Ø Process camera real-time monitoring of tin melting status
Ø 10um high-precision alignment components
Ø Nitrogen operation

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