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Description
The RES100R Real-time High-Precision Photoelasticity Instrument is a non-destructive, full-field, high-precision, and real-time automated measurement system developed based on patented technology. Even users unfamiliar with photoelastic techniques can operate it with ease.
An advanced model, the RES100Rμ, offers a microscopic field of view, enabling micron-level resolution for detecting micro-defects and their associated stress distribution.
It is especially suited for accurately measuring residual stress, processing-induced stress, and low-level stress across the entire field in low photoelastic effect materials such as thin and ultra-thin glass.
Key Features
Full-field stress quantification at the macroscopic scale
Precise micro-defect stress detection at the microscopic scale
Rapid assessment of processing quality
Stress-optical coefficient measurement via loading fixtures
Applications
Materials: Glass, polymer materials, sapphire glass, semiconductor wafers, etc.
Industries: Advanced packaging, display technology, semiconductors, touch panels, flexible PCBs, LED lighting, mechanical engineering, biomedical fields, and more.
An advanced model, the RES100Rμ, offers a microscopic field of view, enabling micron-level resolution for detecting micro-defects and their associated stress distribution.
It is especially suited for accurately measuring residual stress, processing-induced stress, and low-level stress across the entire field in low photoelastic effect materials such as thin and ultra-thin glass.
Key Features
Full-field stress quantification at the macroscopic scale
Precise micro-defect stress detection at the microscopic scale
Rapid assessment of processing quality
Stress-optical coefficient measurement via loading fixtures
Applications
Materials: Glass, polymer materials, sapphire glass, semiconductor wafers, etc.
Industries: Advanced packaging, display technology, semiconductors, touch panels, flexible PCBs, LED lighting, mechanical engineering, biomedical fields, and more.
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