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Description
Co-intersecting two-dimensional profile measuring instrument
Mainly used in: Ink thickness measuring instrument/MLCC thickness measurement/Thick film circuit measurement/Silver paste thickness measurement
Laser etching measurement/glue thickness measurement/semiconductor/special material surface roughness measurement, etc.
Lower cost---1/2 to 1/3 the price of traditional contact profiler
Smaller volume---1/4 the volume of traditional contact profiler, convenient for system integration
Smaller measurement spot---measurement spot 2um
Higher precision---10nm repeatability, 20nm measurement accuracy
Non-contact measurement---no scratch on the sample surface, no probe loss
Mainly used in: Ink thickness measuring instrument/MLCC thickness measurement/Thick film circuit measurement/Silver paste thickness measurement
Laser etching measurement/glue thickness measurement/semiconductor/special material surface roughness measurement, etc.
Lower cost---1/2 to 1/3 the price of traditional contact profiler
Smaller volume---1/4 the volume of traditional contact profiler, convenient for system integration
Smaller measurement spot---measurement spot 2um
Higher precision---10nm repeatability, 20nm measurement accuracy
Non-contact measurement---no scratch on the sample surface, no probe loss
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