FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Taiwanese thermal processing equipment maker WEISUN Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to its AQWOL-5S Smart Clean Room and Inert Gas Oven, aimed at OSAT and substrate makers running fan-out panel level packaging (FOPLP) lines. The chamber is sized to a single panel format, against the standard chamber built for panels up to 700 x 700mm.

Warpage and alignment error scale with panel area. They are introduced during cure and anneal. Oven performance therefore bears directly on panel level packaging yield.

Chamber Sized to One Panel Format

The 310mm configuration holds 25 panels per cassette in a chamber sized for the format. Process controls are the same as the standard version. Airflow is regulated through an 8-zone automatic damper system, against the 28 zones the larger chamber requires across its working area. Temperature uniformity is specified at ±3°C. A smaller working volume means less gas to purge and less thermal mass to hold stable.

Sub-50ppm Oxygen for PI BCB and PBO Cure

The oven runs from room temperature to 200°C in a Class 100 clean environment, holding in-chamber oxygen below 50ppm to prevent substrate oxidation during thermal processing. The standard configuration holds temperature uniformity within ±1.5 percent. Cooling is available as air cooling with N2 or CDA, or water cooling, with a rapid air-cooling system available as an option.

The standard configuration accepts steel carriers up to 700 x 700mm at 4mm thickness and 15kg per sheet. Glass panel sizes run from 310 x 310mm on the 25-slot cassette up to 700 x 700mm on a 12-layer carrying rack.

W-AIMS Machine Learning Monitoring

The oven can be supplied with W-AIMS, WEISUN’s own control and monitoring software, which evaluates the condition of the airflow system across HEPA filter pressure differential, chamber airtightness, damper zone behavior and ventilation efficiency, and returns maintenance recommendations ranked by severity against configurable limits. Evaluation uses machine learning models trained before shipment and then adapted to the customer’s actual process parameters on site. These four subsystems govern the oxygen concentration, cleanliness class and temperature uniformity the oven is specified against.

SEMI E187 Cybersecurity Verified

WEISUN completed SEMI E187 compliance verification for fab equipment, the semiconductor industry’s cybersecurity specification, at the end of 2024. The company holds both ISO 9001 and ISO 27001 certification and develops and manufactures in Taiwan, which accounts for the largest share of global advanced packaging substrate production capacity.

SECS/GEM and CIM Integration

The oven communicates over CIM, Ethernet and SECS/GEM, and PCB ECI, and supports manual loading as well as automated handling through AMR-robot or conveyor-robot configurations. Production status, temperature and oxygen concentration are available remotely, with logging for process history and traceability.

Automation Taipei Booth L426

WEISUN will show both configurations at Automation Taipei, August 19 to 22, 2026, at Nangang Exhibition Hall 1.

Built to Order

The AQWOL-5S is made to order in either configuration. WEISUN sells directly and through appointed distributors, with existing coverage in China and Southeast Asia. Specifications and sales inquiries: https://www.wei-sun-oven.com/product_d.php?lang=en&tb=2&id=992

About WEISUN Industrial Co., Ltd.

WEISUN Industrial Co., Ltd. is a Taiwan-based manufacturer of industrial drying and thermal processing equipment headquartered in New Taipei City. Founded in 1976 as a contract manufacturer for other drying equipment makers, the company launched its own WEISUN brand in 2009 and has since transitioned to a fully self-branded, Taiwan-made model. WEISUN serves the semiconductor, PCB, flat panel and LED industries. Customers include Intel, Micron, GlobalFoundries, ASE and Unimicron. https://www.wei-sun-oven.com