LINX Taiwan Supports Semiconductor Leaders to Drive Inspection Innovation

(Taipei, Taiwan, May 15, 2025) – As semiconductor technologies rapidly evolve, demands for higher yield in advanced manufacturing processes continue to intensify. At the 2025 North America Technology Symposium held recently in Santa Clara, California, global semiconductor leader TSMC (2330) announced its next-generation A14 process had surpassed expected yield performance, with mass production projected for 2028. Yield optimization has become a critical competitive factor in global chip production, and high-precision machine vision inspection is playing a key role.

Machine vision inspection (MVI) technologies are increasingly replacing manual inspection in advanced manufacturing, offering precise detection of micro-defects and significantly reducing false rejects. With over three decades of development in Taiwan, MVI has seen strong demand growth driven by advanced packaging and high-resolution manufacturing, resulting in a surge of interest in industrial cameras, optical modules, and other key components.

Founded in 1990, LINX Taiwan is a pioneer in Taiwan’s machine vision industry. Since joining Japan’s LINX Group in 2020, the company has expanded its global sourcing and integration capabilities. Its solutions are widely used in semiconductor, PCB, and display panel manufacturing, helping clients overcome production bottlenecks and improve both yield and efficiency.

As wafer inspection advances into the submicron era, manufacturers are increasingly challenged to capture high-resolution images within constrained spaces. In 2024, LINX Taiwan supported a major Taiwanese semiconductor company in deploying a compact, vibration-free autofocus optical module capable of extending depth of field within one second. This solution significantly reduced inspection time and improved spatial efficiency. By actively sourcing cutting-edge technologies worldwide, LINX Taiwan continues to deliver breakthrough solutions tailored to real-world inspection challenges—setting it apart from traditional component distributors through technical integration and application-driven innovation.

In another case, an equipment manufacturer struggled to meet end-customer demands for wafer inspection speed due to limitations of area-scan cameras. LINX Taiwan introduced a solution integrating line-scan cameras, autofocus modules, and darkfield lighting, enabling higher throughput and improved detection of subtle surface scratches. The enhanced performance helped the client secure a critical market win.

Another major IC packaging house faced difficulties in detecting chip defects due to complex designs that traditional algorithms couldn’t handle. LINX Taiwan introduced an AI software integrated with the existing inspection setup and MES (Manufacturing Execution System), enabling real-time defect correction early in the process. This dramatically improved both accuracy and productivity, with detection rates approaching 100%—a significant milestone in smart manufacturing.

LINX Taiwan notes that as Taiwan’s high-tech manufacturing sectors move toward higher resolutions and more precise processes, the potential applications of machine vision technologies and components will only expand. The company welcomes industry professionals and automation adopters to explore the latest innovations and practical case studies in optical inspection.

For more information, please visit the LINX Taiwan official website:
https://bit.ly/3Gr0Rb1